Steven H Slater
Firm Name:
Slater & Matsil, L.L.P.
Firm Number:
972-732-1001
Registration Number:
35,361
Available Cases:
252
Prosecution Experience - By US Class
| Class Number | Total Cases |
|---|---|
| 257 - ACTIVE SOLID-STATE DEVICES (E.G.,TRANSISTORS, SOLID-STATE DIODES) | 140 |
| 438 - SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS | 65 |
| 365 - STATIC INFORMATION STORAGE AND RETRIEVAL | 7 |
| 327 - MISCELLANEOUS ACTIVE ELECTRICAL NONLINEAR DEVICES, CIRCUITS, AND SYSTEMS | 5 |
| 361 - ELECTRICITY: ELECTRICAL SYSTEMS AND DEVICES | 4 |
| 228 - METAL FUSION BONDING | 3 |
| 430 - RADIATION IMAGERY CHEMISTRY: PROCESS, COMPOSITION, OR PRODUCT THEREOF | 3 |
| 348 - TELEVISION | 2 |
| 331 - OSCILLATORS | 2 |
| 323 - ELECTRICITY: POWER SUPPLY OR REGULATION SYSTEMS | 2 |
| 455 - TELECOMMUNICATIONS | 2 |
| 356 - OPTICS:MEASURING AND TESTING | 1 |
| 714 - ERROR DETECTION/CORRECTION AND FAULT DETECTION/RECOVERY | 1 |
| 250 - RADIANT ENERGY | 1 |
| 341 - CODED DATA GENERATION OR CONVERSION | 1 |
| 216 - ETCHING A SUBSTRATE: PROCESSES | 1 |
| 269 - WORK HOLDERS | 1 |
| 136 - BATTERIES: THERMOELECTRIC AND PHOTOELECTRIC | 1 |
| 716 - COMPUTER-AIDED DESIGN AND ANALYSIS OF CIRCUITS AND SEMICONDUCTOR MASKS | 1 |
| 709 - ELECTRICAL COMPUTERS AND DIGITAL PROCESSING SYSTEMS: MULTICOMPUTER DATA TRANSFERRING | 1 |
| 372 - COHERENT LIGHT GENERATORS | 1 |
| 702 - DATA PROCESSING: MEASURING, CALIBRATING, OR TESTING | 1 |
| 381 - ELECTRICAL AUDIO SIGNAL PROCESSING SYSTEMS AND DEVICES | 1 |
| 326 - ELECTRONIC DIGITAL LOGIC CIRCUITRY | 1 |
| 102 - AMMUNITION AND EXPLOSIVES | 1 |
| 330 - AMPLIFIERS | 1 |
| 705 - DATA PROCESSING: FINANCIAL, BUSINESS PRACTICE, MANAGEMENT, OR COST/PRICE DETERMINATION | 1 |
| 290 - PRIME-MOVER DYNAMO PLANTS | 1 |
US Case List ?
| Serial Number | Class/Subclass | Invention Title | Ownership History ? | Contribution ? |
|---|---|---|---|---|
| 10621... | 709/238 | ATOMIC SELF-HEALING ... | Unlock | Prosecuted (auto) |
| 11294... | 257/774 | VIA STRUCTURE WITH I... | Unlock | Prosecuted (auto) |
| 11692... | 381/077 | INTELLIGENT AUDIO SP... | Unlock | Prosecuted (auto) |
| 12100... | 136/259 | PHOTOVOLTAICS ON SIL... | Unlock | Prosecuted (auto) |
| 12484... | 361/234 | Replaceable Electros... | Unlock | Prosecuted (auto) |
| 12543... | 290/053 | ENERGY-HARVESTING, S... | Unlock | Prosecuted (auto) |
| 12702... | 102/477 | MINE-DEFEATING PROJE... | Unlock | Prosecuted (auto) |
| 12704... | 438/613 | PILLAR STRUCTURE HAV... | Unlock | Prosecuted (auto) |
| 12708... | 257/327 | SELECTIVE EPITAXIAL ... | Unlock | Prosecuted (auto) |
| 12713... | 257/004 | FORMING PHASE-CHANGE... | Unlock | Prosecuted (auto) |
| 12713... | 257/401 | EPITAXY PROFILE ENGI... | Unlock | Prosecuted (auto) |
| 12715... | 257/593 | PROFILE DESIGN FOR L... | Unlock | Prosecuted (auto) |
| 12721... | 455/436 | SYSTEM AND METHOD FO... | Unlock | Prosecuted (auto) |
| 12723... | 257/314 | GATED SEMICONDUCTOR ... | Unlock | Prosecuted (auto) |
| 12729... | 257/738 | LEAD FREE SOLDER INT... | Unlock | Prosecuted (auto) |
| 12789... | 257/411 | Scaling EOT by Elimi... | Unlock | Prosecuted (auto) |
| 12790... | 438/300 | DUAL-SIGE EPITAXY FO... | Unlock | Prosecuted (auto) |
| 12814... | 361/783 | PACKAGE SUBSTRATE... | Unlock | Prosecuted (auto) |
| 12823... | 438/652 | TRANSITIONAL INTERFA... | Unlock | Prosecuted (auto) |
| 12829... | 330/261 | SYSTEM FOR DRIVER AM... | Unlock | Prosecuted (auto) |
| 12831... | 257/368 | CONTROLLING THE SHAP... | Unlock | Prosecuted (auto) |
| 12834... | 257/693 | TSV FORMATION PROCES... | Unlock | Prosecuted (auto) |
| 12834... | 361/783 | INTERPOSER-ON-GLASS ... | Unlock | Prosecuted (auto) |
| 12838... | 257/621 | THROUGH SILICON VIA ... | Unlock | Prosecuted (auto) |
| 12841... | 228/180.220 | THERMAL COMPRESS BON... | Unlock | Prosecuted (auto) |
| 12842... | 365/226 | METHOD FOR EXTENDING... | Unlock | Prosecuted (auto) |
| 12843... | 365/194 | SENSE AMPLIFIER ENAB... | Unlock | Prosecuted (auto) |
| 12843... | 257/401 | FINFETS WITH MULTIPL... | Unlock | Prosecuted (auto) |
| 12843... | 438/614 | DOPING MINOR ELEMENT... | Unlock | Prosecuted (auto) |
| 12844... | 430/022 | DEFENSE SYSTEM IN AD... | Unlock | Prosecuted (auto) |
| 12845... | 257/618 | LATTICE-MISMATCHED S... | Unlock | Prosecuted (auto) |
| 12847... | 438/429 | Inverted Trapezoidal... | Unlock | Prosecuted (auto) |
| 12852... | 257/327 | LAYOUT AND PROCESS O... | Unlock | Prosecuted (auto) |
| 12907... | 257/773 | DOUBLE PATTERNING TE... | Unlock | Prosecuted (auto) |
| 12910... | 257/339 | FULLY ISOLATED HIGH-... | Unlock | Prosecuted (auto) |
| 12910... | 438/296 | TWO-STEP STI FORMATI... | Unlock | Prosecuted (auto) |
| 12938... | 327/132 | SUMMATION CIRCUIT IN... | Unlock | Prosecuted (auto) |
| 12938... | 323/314 | VOLTAGE REGULATOR AR... | Unlock | Prosecuted (auto) |
| 12944... | 257/781 | BONDING METALLURGY F... | Unlock | Prosecuted (auto) |
| 12953... | 257/737 | MOLDED CHIP INTERPOS... | Unlock | Prosecuted (auto) |
| 12954... | 228/176 | THERMAL GRADIENT REF... | Unlock | Prosecuted (auto) |
| 13017... | 257/024 | RF CIRCUITS INCLUDIN... | Unlock | Prosecuted (auto) |
| 13051... | 327/333 | LEVEL SHIFTER DESIGN... | Unlock | Prosecuted (auto) |
| 13051... | 365/230.060 | METHODS AND APPARATU... | Unlock | Prosecuted (auto) |
| 13103... | 438/190 | SEMICONDUCTOR DEVICE... | Unlock | Prosecuted (auto) |
| 13105... | 438/286 | REPLACING SYMMETRIC ... | Unlock | Prosecuted (auto) |
| 13107... | 257/190 | TRI-GATE FIELD-EFFEC... | Unlock | Prosecuted (auto) |
| 13115... | 438/643 | SCHEMES FOR FORMING ... | Unlock | Prosecuted (auto) |
| 13149... | 257/738 | REDUCING THE SWITCHI... | Unlock | Prosecuted (auto) |
| 13152... | 326/016 | DUAL-EDGE REGISTER A... | Unlock | Prosecuted (auto) |
| 13162... | 257/781 | WAFER LEVEL CHIP SCA... | Unlock | Prosecuted (auto) |
| 13211... | 257/414 | HOLE FIRST HARDMASK ... | Unlock | Prosecuted (auto) |
| 13219... | 705/035 | WALLET CONSOLIDATOR ... | Unlock | Prosecuted (auto) |
| 13221... | 257/499 | METHOD FOR RESHAPING... | Unlock | Prosecuted (auto) |
| 13225... | 438/022 | GROUP-III NITRIDE EP... | Unlock | Prosecuted (auto) |
| 13234... | 438/652 | Etching Method and A... | Unlock | Prosecuted (auto) |
| 13309... | 269/900 | PACKAGING PROCESS TO... | Unlock | Prosecuted (auto) |
| 13327... | 257/019 | SEMICONDUCTOR STRUCT... | Unlock | Prosecuted (auto) |
| 13339... | 257/173 | Vertical BJT and SCR... | Unlock | Prosecuted (auto) |
| 13339... | 341/163 | SYSTEM AND METHOD FO... | Unlock | Prosecuted (auto) |
| 13342... | 257/443 | Seamless Multi-Poly ... | Unlock | Prosecuted (auto) |
| 13342... | 257/774 | APPROACH FOR BONDING... | Unlock | Prosecuted (auto) |
| 13342... | 257/738 | METHODS AND APPARATU... | Unlock | Prosecuted (auto) |
| 13343... | 257/737 | CONNECTOR DESIGN FOR... | Unlock | Prosecuted (auto) |
| 13351... | 228/039 | THERMAL COMPRESSIVE ... | Unlock | Prosecuted (auto) |
| 13351... | 257/369 | HVMOS DEVICES AND ME... | Unlock | Prosecuted (auto) |
| 13351... | 257/346 | Germanium Field Effe... | Unlock | Prosecuted (auto) |
| 13460... | 257/316 | METHOD OF FABRICATIN... | Unlock | Prosecuted (auto) |
| 13491... | 702/058 | Calibration Kits for... | Unlock | Prosecuted (auto) |
| 13729... | 361/760 | METHODS AND APPARATU... | Unlock | Prosecuted (auto) |
| 13763... | 257/173 | METHODS AND APPARATU... | Unlock | Prosecuted (auto) |
| 13787... | 257/738 | BUMP STRUCTURES FOR ... | Unlock | Prosecuted (auto) |
| 13787... | 257/751 | METHOD FOR FORMING I... | Unlock | Prosecuted (auto) |
| 13802... | 257/004 | LOW FORM VOLTAGE RES... | Unlock | Prosecuted (auto) |
| 13826... | 257/774 | Warpage Control of S... | Unlock | Prosecuted (auto) |
| 13861... | 438/200 | METHODS OF MANUFACTU... | Unlock | Prosecuted (auto) |
| 13902... | 257/288 | Metal-Oxide-Semicond... | Unlock | Prosecuted (auto) |
| 13932... | 257/618 | METHOD AND APPARATUS... | Unlock | Prosecuted (auto) |
| 13935... | 250/239 | Method and Apparatus... | Unlock | Prosecuted (auto) |
| 13936... | 257/369 | DUMMY METAL GATE STR... | Unlock | Prosecuted (auto) |
| 13937... | 257/613 | Fan-Out Interconnect... | Unlock | Prosecuted (auto) |
| 13938... | 365/094 | ROM CHIP MANUFACTURI... | Unlock | Prosecuted (auto) |
| 13938... | 257/737 | DIE-ON-INTERPOSER AS... | Unlock | Prosecuted (auto) |
| 13942... | 714/726 | Method and Apparatus... | Unlock | Prosecuted (auto) |
| 13944... | 257/419 | MEMS Integrated Pres... | Unlock | Prosecuted (auto) |
| 13946... | 430/005 | EXTREME ULTRAVIOLET ... | Unlock | Prosecuted (auto) |
| 13946... | 438/584 | BIOSENSING WELL ARRA... | Unlock | Prosecuted (auto) |
| 13962... | 438/197 | Strained MOS Device ... | Unlock | Prosecuted (auto) |
| 13973... | 323/315 | Bandgap Reference Ci... | Unlock | Prosecuted (auto) |
| 14011... | 438/702 | PATTERNING APPROACH ... | Unlock | Prosecuted (auto) |
| 14013... | 438/003 | Method for Fabricati... | Unlock | Prosecuted (auto) |
| 14015... | 257/773 | 3D Packages and Meth... | Unlock | Prosecuted (auto) |
| 14015... | 257/004 | Resistance Variable ... | Unlock | Prosecuted (auto) |
| 14016... | 365/210.100 | Sample-and-Hold Curr... | Unlock | Prosecuted (auto) |
| 14017... | 356/072 | Stress Analysis of 3... | Unlock | Prosecuted (auto) |
| 14019... | 438/666 | INTERCONNECT STRUCTU... | Unlock | Prosecuted (auto) |
| 14024... | 438/700 | HARD MASK EDGE COVER... | Unlock | Prosecuted (auto) |
| 14024... | 438/283 | BI-LAYER METAL DEPOS... | Unlock | Prosecuted (auto) |
| 14030... | 438/197 | FINLIKE STRUCTURES A... | Unlock | Prosecuted (auto) |
| 14030... | 438/588 | Self-Alignment for u... | Unlock | Prosecuted (auto) |
| 14030... | 257/409 | Coupling Well Struct... | Unlock | Prosecuted (auto) |
| 14033... | 257/253 | BIOSENSING WELL ARRA... | Unlock | Prosecuted (auto) |
| 14039... | 438/267 | MEMORY DEVICES AND M... | Unlock | Prosecuted (auto) |
| 14039... | 257/775 | Contact Pad for Semi... | Unlock | Prosecuted (auto) |
| 14040... | 438/108 | PICK-AND-PLACE TOOL ... | Unlock | Prosecuted (auto) |
| 14040... | 257/336 | Raised Epitaxial LDD... | Unlock | Prosecuted (auto) |
| 14044... | 257/255 | Double Sided NMOS/PM... | Unlock | Prosecuted (auto) |
| 14045... | 257/774 | PACKAGING STRUCTURES... | Unlock | Prosecuted (auto) |
| 14045... | 438/396 | FORMING METAL-INSULA... | Unlock | Prosecuted (auto) |
| 14047... | 257/347 | Passivation Structur... | Unlock | Prosecuted (auto) |
| 14052... | 257/394 | Forming Conductive S... | Unlock | Prosecuted (auto) |
| 14052... | 257/532 | METAL INSULATOR META... | Unlock | Prosecuted (auto) |
| 14054... | 438/458 | METHODS FOR FORMING ... | Unlock | Prosecuted (auto) |
| 14054... | 257/629 | SEMICONDUCTOR FILM W... | Unlock | Prosecuted (auto) |
| 14061... | 327/513 | ELECTRONIC DEVICE WI... | Unlock | Prosecuted (auto) |
| 14061... | 257/737 | SEMICONDUCTOR STRUCT... | Unlock | Prosecuted (auto) |
| 14063... | 438/703 | LITHOGRAPHY USING MU... | Unlock | Prosecuted (auto) |
| 14065... | 257/738 | Methods and Apparatu... | Unlock | Prosecuted (auto) |
| 14072... | 438/675 | Method for Via Plati... | Unlock | Prosecuted (auto) |
| 14074... | 257/737 | Packaging Devices an... | Unlock | Prosecuted (auto) |
| 14075... | 257/777 | CONFIGURABLE ROUTING... | Unlock | Prosecuted (auto) |
| 14079... | 438/218 | Reducing Resistance ... | Unlock | Prosecuted (auto) |
| 14080... | 257/506 | FinFETs with Vertica... | Unlock | Prosecuted (auto) |
| 14083... | 365/156 | DATA-AWARE SRAM SYST... | Unlock | Prosecuted (auto) |
| 14090... | 257/773 | Interconnect Structu... | Unlock | Prosecuted (auto) |
| 14092... | 257/432 | Diffraction Grating ... | Unlock | Prosecuted (auto) |
| 14093... | 257/408 | Contact Structure of... | Unlock | Prosecuted (auto) |
| 14097... | 438/458 | Temporary Bonding Sc... | Unlock | Prosecuted (auto) |
| 14103... | 438/244 | Capacitor and Method... | Unlock | Prosecuted (auto) |
| 14137... | 257/774 | Backside Redistribut... | Unlock | Prosecuted (auto) |
| 14137... | 257/401 | Fin Structure of Sem... | Unlock | Prosecuted (auto) |
| 14144... | 438/401 | Interconnect Structu... | Unlock | Prosecuted (auto) |
| 14144... | 257/192 | RECTIFIER STRUCTURES... | Unlock | Prosecuted (auto) |
| 14145... | 257/298 | INTERCONNECT STRUCTU... | Unlock | Prosecuted (auto) |
| 14158... | 257/192 | FINFET SEMICONDUCTOR... | Unlock | Prosecuted (auto) |
| 14159... | 438/758 | SEMICONDUCTOR PROCES... | Unlock | Prosecuted (auto) |
| 14183... | 257/774 | INTERPOSER HAVING A ... | Unlock | Prosecuted (auto) |
| 14184... | 438/018 | APPARATUS AND METHOD... | Unlock | Prosecuted (auto) |
| 14189... | 257/786 | Wafer Bonding Proces... | Unlock | Prosecuted (auto) |
| 14220... | 257/401 | Adaptive Fin Design ... | Unlock | Prosecuted (auto) |
| 14245... | 438/595 | DEVICE HAVING SLOPED... | Unlock | Prosecuted (auto) |
| 14273... | 438/238 | METAL-SEMICONDUCTOR ... | Unlock | Prosecuted (auto) |
| 14319... | 257/215 | CONDUCTIVE ELEMENT S... | Unlock | Prosecuted (auto) |
| 14325... | 438/108 | RDL-FIRST PACKAGING ... | Unlock | Prosecuted (auto) |
| 14448... | 257/738 | Interconnect Structu... | Unlock | Prosecuted (auto) |
| 14453... | 257/737 | Protrusion Bump Pads... | Unlock | Prosecuted (auto) |
| 14460... | 257/774 | PACKAGES AND METHODS... | Unlock | Prosecuted (auto) |
| 14464... | 257/774 | Interconnect Structu... | Unlock | Prosecuted (auto) |
| 14466... | 438/106 | SEMICONDUCTOR PACKAG... | Unlock | Prosecuted (auto) |
| 14468... | 438/614 | Pillar Bumps and Pro... | Unlock | Prosecuted (auto) |
| 14471... | 257/779 | Packaged Semiconduct... | Unlock | Prosecuted (auto) |
| 14485... | 257/329 | Silicide Region of G... | Unlock | Prosecuted (auto) |
| 14486... | 257/586 | METHODS AND APPARATU... | Unlock | Prosecuted (auto) |
| 14491... | 438/108 | Dummy Flip Chip Bump... | Unlock | Prosecuted (auto) |
| 14491... | 257/774 | 3DIC INTERCONNECT DE... | Unlock | Prosecuted (auto) |
| 14497... | 331/036.00C | ELECTRONIC DEVICE WI... | Unlock | Prosecuted (auto) |
| 14497... | 438/108 | SEMICONDUCTOR PACKAG... | Unlock | Prosecuted (auto) |
| 14500... | 327/333 | MULTIPLE POWER DOMAI... | Unlock | Prosecuted (auto) |
| 14515... | 257/019 | CONTACT RESISTANCE R... | Unlock | Prosecuted (auto) |
| 14517... | 438/458 | Debonding Schemes... | Unlock | Prosecuted (auto) |
| 14519... | 438/778 | Methods Of Manufactu... | Unlock | Prosecuted (auto) |
| 14523... | 716/113 | Method for Displayin... | Unlock | Prosecuted (auto) |
| 14525... | 438/238 | MIM Capacitors with ... | Unlock | Prosecuted (auto) |
| 14525... | 257/187 | CIS Image Sensors wi... | Unlock | Prosecuted (auto) |
| 14527... | 257/192 | FinFETs with Source/... | Unlock | Prosecuted (auto) |
| 14527... | 257/686 | Electrostatic Discha... | Unlock | Prosecuted (auto) |
| 14529... | 257/686 | Integrated Fan-Out S... | Unlock | Prosecuted (auto) |
| 14530... | 257/460 | Interconnect Structu... | Unlock | Prosecuted (auto) |
| 14531... | 438/106 | Packaged Semiconduct... | Unlock | Prosecuted (auto) |
| 14536... | 438/283 | HIGH MOBILITY DEVICE... | Unlock | Prosecuted (auto) |
| 14542... | 257/797 | Alignment Mark and M... | Unlock | Prosecuted (auto) |
| 14543... | 257/738 | Stacked Dies With Wi... | Unlock | Prosecuted (auto) |
| 14546... | 257/666 | Methods and Apparatu... | Unlock | Prosecuted (auto) |
| 14546... | 438/614 | INTEGRATED CIRCUIT P... | Unlock | Prosecuted (auto) |
| 14547... | 438/107 | Apparatus and Method... | Unlock | Prosecuted (auto) |
| 14547... | 257/369 | SEMICONDUCTOR DEVICE... | Unlock | Prosecuted (auto) |
| 14547... | 327/143 | MULTIPLE POWER DOMAI... | Unlock | Prosecuted (auto) |
| 14554... | 257/369 | FIN FIELD EFFECT TRA... | Unlock | Prosecuted (auto) |
| 14586... | 438/264 | A FET DEVICE HAVING ... | Unlock | Prosecuted (auto) |
| 14591... | 438/283 | FinFETs with Differe... | Unlock | Prosecuted (auto) |
| 14593... | 257/774 | Structure and Method... | Unlock | Prosecuted (auto) |
| 14603... | 257/633 | Post Passivation Int... | Unlock | Prosecuted (auto) |
| 14610... | 257/741 | INTEGRATED CIRCUIT W... | Unlock | Prosecuted (auto) |
| 14613... | 365/072 | MULTIPLE-PORT SRAM D... | Unlock | Prosecuted (auto) |
| 14632... | 372/050.230 | Light Coupling Devic... | Unlock | Prosecuted (auto) |
| 14640... | 257/329 | Vertical Gate All Ar... | Unlock | Prosecuted (auto) |
| 14658... | 257/401 | SEMICONDUCTOR DEVICE... | Unlock | Prosecuted (auto) |
| 14668... | 438/610 | Semiconductor Device... | Unlock | Prosecuted (auto) |
| 14690... | 257/774 | Fan-out POP Structur... | Unlock | Prosecuted (auto) |
| 14721... | 257/738 | Single Mask Package ... | Unlock | Prosecuted (auto) |
| 14721... | 438/073 | Image Device and Met... | Unlock | Prosecuted (auto) |
| 14721... | 257/004 | RRAM DEVICES... | Unlock | Prosecuted (auto) |
| 14725... | 257/369 | STRUCTURE AND FORMAT... | Unlock | Prosecuted (auto) |
| 14731... | 257/415 | MEMS STRUCTURES AND ... | Unlock | Prosecuted (auto) |
| 14732... | 257/347 | Three-Dimensional Tr... | Unlock | Prosecuted (auto) |
| 14732... | 257/316 | MEMORY DEVICES AND M... | Unlock | Prosecuted (auto) |
| 14745... | 257/738 | APPARATUS AND PACKAG... | Unlock | Prosecuted (auto) |
| 14753... | 257/029 | Semiconductor Device... | Unlock | Prosecuted (auto) |
| 14753... | 438/283 | MULTIPLE GATE FIELD-... | Unlock | Prosecuted (auto) |
| 14803... | 257/415 | Support Structure fo... | Unlock | Prosecuted (auto) |
| 14804... | 257/737 | CONDUCTIVE CONTACTS ... | Unlock | Prosecuted (auto) |
| 14811... | 438/637 | Conductive Line Patt... | Unlock | Prosecuted (auto) |
| 14815... | 257/190 | Passivation Structur... | Unlock | Prosecuted (auto) |
| 14818... | 257/418 | Methods and Apparatu... | Unlock | Prosecuted (auto) |
| 14831... | 257/190 | Semiconductor Liner ... | Unlock | Prosecuted (auto) |
| 14833... | 438/620 | NON-HIERARCHICAL MET... | Unlock | Prosecuted (auto) |
| 14841... | 257/432 | Elevated Photodiode ... | Unlock | Prosecuted (auto) |
| 14845... | 257/774 | Semiconductor Device... | Unlock | Prosecuted (auto) |
| 14846... | 438/283 | Forming Crown Active... | Unlock | Prosecuted (auto) |
| 14849... | 430/270.100 | PHOTORESIST AND METH... | Unlock | Prosecuted (auto) |
| 14851... | 257/712 | Thermally Enhanced S... | Unlock | Prosecuted (auto) |
| 14858... | 438/283 | FinFET Structures an... | Unlock | Prosecuted (auto) |
| 14860... | 455/041.100 | Method for a Contact... | Unlock | Prosecuted (auto) |
| 14886... | 257/724 | Semiconductor Device... | Unlock | Prosecuted (auto) |
| 14923... | 257/443 | Stress Release Layou... | Unlock | Prosecuted (auto) |
| 14931... | 257/621 | Metal Pad Structure ... | Unlock | Prosecuted (auto) |
| 14942... | 331/177.00R | Electronic Device wi... | Unlock | Prosecuted (auto) |
| 14970... | 257/774 | 3D PACKAGES AND METH... | Unlock | Prosecuted (auto) |
| 14970... | 257/737 | SEMICONDUCTOR DEVICE... | Unlock | Prosecuted (auto) |
| 14983... | 438/047 | DIODE-BASED DEVICES ... | Unlock | Prosecuted (auto) |
| 14996... | 257/411 | Methods and Apparatu... | Unlock | Prosecuted (auto) |
| 15016... | 438/785 | Deposited Material a... | Unlock | Prosecuted (auto) |
| 15043... | 257/401 | FinFET with Bottom S... | Unlock | Prosecuted (auto) |
| 15061... | 257/431 | Image Sensor with Lo... | Unlock | Prosecuted (auto) |
| 15062... | 257/704 | Packaged Semiconduct... | Unlock | Prosecuted (auto) |
| 15068... | 257/773 | Semiconductor Device... | Unlock | Prosecuted (auto) |
| 15070... | 438/599 | Power Gating for Thr... | Unlock | Prosecuted (auto) |
| 15070... | 257/432 | Methods and Apparatu... | Unlock | Prosecuted (auto) |
| 15071... | 257/532 | Integrated Capacitor... | Unlock | Prosecuted (auto) |
| 15085... | 257/737 | Package Having Subst... | Unlock | Prosecuted (auto) |
| 15089... | 348/014.080 | TelePresence Archite... | Unlock | Prosecuted (auto) |
| 15090... | 438/687 | 3D PACKAGE WITH THRO... | Unlock | Prosecuted (auto) |
| 15090... | 348/014.030 | Architectural Scale ... | Unlock | Prosecuted (auto) |
| 15095... | 438/107 | Hollow Metal Pillar ... | Unlock | Prosecuted (auto) |
| 15096... | 257/401 | Multi-Fin Device and... | Unlock | Prosecuted (auto) |
| 15134... | 257/190 | Methods and Apparatu... | Unlock | Prosecuted (auto) |
| 15144... | 438/381 | Capacitor in Post-Pa... | Unlock | Prosecuted (auto) |
| 15150... | 257/292 | Method and Apparatus... | Unlock | Prosecuted (auto) |
| 15152... | 257/285 | Modulating Germanium... | Unlock | Prosecuted (auto) |
| 15152... | 257/773 | Integrated Circuit U... | Unlock | Prosecuted (auto) |
| 15152... | 257/288 | FETs and Methods for... | Unlock | Prosecuted (auto) |
| 15152... | 438/612 | Packaging Devices an... | Unlock | Prosecuted (auto) |
| 15160... | 257/211 | Interconnect Structu... | Unlock | Prosecuted (auto) |
| 15166... | 438/586 | Jog Design in Integr... | Unlock | Prosecuted (auto) |
| 15169... | 257/738 | Packaging Devices an... | Unlock | Prosecuted (auto) |
| 15172... | 257/706 | 3DIC Packages with H... | Unlock | Prosecuted (auto) |
| 15181... | 257/678 | Apparatus and Method... | Unlock | Prosecuted (auto) |
| 15202... | 216/052 | Method of Forming Mu... | Unlock | Prosecuted (auto) |
| 15202... | 257/678 | Reinforcement Struct... | Unlock | Prosecuted (auto) |
| 15213... | 257/347 | Mechanism for FinFET... | Unlock | Prosecuted (auto) |
| 15226... | 438/623 | VIA PATTERNING USING... | Unlock | Prosecuted (auto) |
| 15243... | 257/774 | Dummy Structure for ... | Unlock | Prosecuted (auto) |